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QianLi iCopy-S Double-sided Baseband Module For iPhone 6-XS MAX Soldering Tip iPhone baseband CPU NAND BGA

SKU: 65800756325

4.5
USD94.99 USD144.99

Pay in 4 interest-free payments of $23.75 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 29 - Sep 3

Description

iPhone baseband CPU NAND BGA reballing tin net stencils with magnetic base positioning fixture

JY02 Intelligent Grinding Machine is the upgraded version of JY01

and other small chips

Machine weight: 2

supporting the use of soldering iron

QianLi iCopy-S Double-sided Baseband Module For iPhone 6-XS MAX Soldering Tip iPhone baseband CPU NAND BGAQianli iCopy S 4 in 1 double side chip test frame for iPhone 6 6P 6S 6SP 7 7P 8 8P X XS MAX XR motherboard repair tool, ToolPlus QianLi iCopy S 4 in 1 test fixture non removal module for iPhone 6 6P 6S 6SP 7 7P 8 8P X XR XS MAX logic baseband EEPROM chip, iCopy S 4 in 1 non removal module for read, write program logic chip, Intel, and Qualcomm baseband chip. QianLi iCopy S 4 IN 1 Double sided Logic Baseband EEPROM Chip Non removal Module For iPhone 6

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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